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given their specs [1] show ~100 mm^2 of silicon for each billion params (albeit in 6 nm process), what will come first: nuclear fusion or one of these that can handle the multi-trillon param models of today?

[1] https://taalas.com/products/



According to my agent:

> At 6 nm: 1T doesn't fit on one wafer.

> At ~2 nm: 1T plausibly fits comfortably on one 300 mm wafer.

But then again, 300B to 500B models are to this day also very valuable


You're assuming no improvement on their current technology




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